Christian Wong

Particle and Substrate Charge Effects on Colloidal Self-Assembly in a Sessile Drop

Qingfeng Yan, Li Gao, Vyom Sharma et al. · Langmuir · 2008 · 85 citations

Colloidal Material, Engineering, Super-hydrophobic Surface +17

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Aditya Kumar, Zhong Chen, Subodh G. Mhaisalkar et al. · Thin Solid Films · 2005 · 77 citations · Full text

Materials Engineering, Materials Science, Engineering +7

Improved Utilization of Photogenerated Charge Using Fluorine-Doped TiO₂ Hollow Spheres Scattering Layer in Dye-Sensitized Solar Cells

Jun‐Ling Song, Hong Bin Yang, Xiu Wang et al. · ACS Applied Materials & Interfaces · 2012 · 73 citations

Materials Science, Engineering, Photochemistry +13

Growth imperfections in three-dimensional colloidal self-assembly

Lay Kuan Teh, Nathanael Tan, Christian Wong et al. · Applied Physics A · 2004 · 70 citations

Materials Science, Pattern Formation, Colloidal Material +7

Moisture-induced failures of adhesive flip chip interconnects

Lay Kuan Teh, Mary Teo, E. Anto et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 62 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +13