Aditya Kumar

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder

Aditya Kumar, Min He, Zhong Chen · Surface and Coatings Technology · 2004 · 56 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

Aditya Kumar, Mingyi He, Zhong Chen et al. · Thin Solid Films · 2004 · 50 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12

Interfacial reaction between Sn-rich solders and Ni-based metallization

Man He, Aditya Kumar, Pauline Yeo et al. · Thin Solid Films · 2004 · 48 citations · Full text

Engineering, Materials Engineering, Materials Science +15

Investigation of the Wetting Behavior of Formulated SMAW Electrode Coating Fluxes With Regression and ANN Model

Aditya Kumar, Rahul Chhibber · Metallurgical and Materials Transactions B · 2022 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +16