Concepedia

Seng Guan Chow

SG

3

Publications

49

Citations

3

H-Index

2010

Active since

Affiliations

STATS ChipPAC (Singapore)(Current)

Seng Guan Chow is an author at STATS ChipPAC (Singapore) specializing in microelectronics, mechanics of materials, and engineering.

Top concepts

Publications per year

2010–2012

3

Publications

3

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang, MyoungSu Chae, Seng Guan Chow et al. · IMAPSource Proceedings · 2010 · 22 citations · Full text

, , +15

A finite element analysis of board level temperature cycling reliability of embedded wafer level BGA (eWLB) package

Seng Guan Chow, Yaojian Lin, Eric Ouyang et al. · 2012 · 15 citations

, , +25

Board level solder joint reliability modeling of Embedded Wafer Level BGA (eWLB) packages under temperature cycling test conditions

Seng Guan Chow, Won Kyoung Choi, Roger Emigh et al. · 2011 · 12 citations

, , +21

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