Concepedia

MyoungSu Chae

MC

2

Publications

46

Citations

2

H-Index

2010

Active since

MyoungSu Chae is an author specializing in mechanical engineering, electronic packaging, and mechanics of materials.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsDesign3D PrintingSocial SciencesMicroelectronicsMicrofabricationIndustrial Design

Publications per year

2010–2013

2

Publications

2

Strip warpage analysis of a flip chip package considering the mold compound processing parameters

MyoungSu Chae, Eric Ouyang · 2013 · 24 citations

Engineering, Flip Chip Package, Mechanical Engineering +21

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang, MyoungSu Chae, Seng Guan Chow et al. · IMAPSource Proceedings · 2010 · 22 citations · Full text

Interconnect Structure, Electrical Engineering, Chip-scale Package +15

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