Concepedia

Jae Hoon Ku

JH

1

Publications

36

Citations

1

H-Index

2009

Active since

Affiliations

STATS ChipPAC (Singapore)(Current)

Jae Hoon Ku is an author at STATS ChipPAC (Singapore) specializing in 3d printing, microfabrication, and microelectronics.

Top concepts

3D PrintingEngineeringMaterial ScienceMicroelectronicsMicrofabricationComputer EngineeringElectronic Packaging

Publications per year

2009–2009

1

Publications

1

Fabrication and packaging of microbump interconnections for 3D TSV

Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn et al. · 2009 · 36 citations

Materials Science, 3D Ic Architecture, Chip-scale Package +13

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