Concepedia

Nathapong Suthiwongsunthorn

NS

5

Publications

88

Citations

5

H-Index

2009

Active since

Affiliations

Silicon Labs (United States)(Current)

Nathapong Suthiwongsunthorn is an author at Silicon Labs (United States) specializing in engineering, electronic packaging, and computer engineering.

Top concepts

EngineeringComputer EngineeringElectronic Packaging3D PrintingMicroelectronicsMaterial ScienceMicrofabricationIndustrial DesignPower ElectronicsComputer-aided Design

Publications per year

2009–2016

5

Publications

5

Fabrication and packaging of microbump interconnections for 3D TSV

Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn et al. · 2009 · 36 citations

Materials Science, 3D Ic Architecture, Chip-scale Package +13

Copper clip package for high performance MOSFETs and its optimization

Kyaw Ko Lwin, Carolyn Epino Tubillo, T. Jun Dimaano Panumard et al. · 2016 · 18 citations

3D Ic Architecture, Electrical Engineering, Copper Clips +11

Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

J. Tamil, Siew Hoon Ore, Kian Yeow Gan et al. · IMAPSource Proceedings · 2011 · 13 citations · Full text

Flip Chip Technology, Engineering, Mechanical Engineering +16

Tapered Through-Silicon-Via Interconnects for Wafer-Level Packaging of Sensor Devices

Jüergen Leib, Florian Bieck, Ulli Hansen et al. · IEEE Transactions on Advanced Packaging · 2010 · 11 citations

Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

J. Tamil, Siew Hoon Ore, Kian Yeow Gan et al. · Journal of Microelectronics and Electronic Packaging · 2012 · 10 citations

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