Flynn Carson

3D TSV processes and its assembly/packaging technology

Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo et al. · 2009 · 66 citations

Engineering, Computer-aided Design, Material Handling +18

3-D Stacked Package Technology and Trends

Flynn Carson, In Sang Yoon · Proceedings of the IEEE · 2009 · 47 citations

Pip Packages, Engineering, Computer Architecture +17

Fabrication and packaging of microbump interconnections for 3D TSV

Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn et al. · 2009 · 36 citations

Materials Science, 3D Ic Architecture, Chip-scale Package +13

Package on Package warpage - impact on surface mount yields and board level reliability

Niranjan Vijayaragavan, Flynn Carson, Addi Mistry · 2008 · 34 citations

Top Pop, Engineering, Package Warpage +18

A New Approach to Stick-Slip Management Integrating Bit Design and Rotary-Steerable-System Characteristics

M. R. Niznik, Anne Carson, K.D. Wise et al. · Proceedings of IADC/SPE Drilling Conference · 2006 · 30 citations

Rotary-steerable-system Characteristics, Engineering, Slide Dynamic +7