Statistics
Publications
1
Citations
66
H-Index
1
Active since
2009
Affiliations
STATS ChipPAC (Singapore)(Current)
Dae Wook Yang is an author at STATS ChipPAC (Singapore) specializing in engineering, wafer-level packaging, and wafer thinning.
Publications per year
2009–2009
1
1
3D TSV processes and its assembly/packaging technology
Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo et al. · 2009 · 66 citations
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