Concepedia
Statistics
Publications
14
Citations
291
H-Index
11
Active since
1985
Affiliations
STATS ChipPAC (Singapore)(Current)
Texas Instruments (United States)
University of California, Berkeley
Hewlett-Packard (United States)
R. Pendse is an author at STATS ChipPAC (Singapore) specializing in engineering, chip packaging, and semiconductor devices.
Publications per year
1985–2011
Methodology for predicting solder joint reliability in semiconductor packages
R. Pendse, Peng Zhou · Microelectronics Reliability · 2002 · 46 citations
Engineering, Electrical Engineering, Materials Engineering +13
The influence of alloy microstructure on the oxide peg morphologies in a Co-10% Cr-11%Al alloy with and without reactive element additions
R. Pendse, J. Stringer · Oxidation of Metals · 1985 · 35 citations
Natural Sciences, Materials Engineering, Materials Science +15
Molded underfill (MUF) technology for flip chip packages in mobile applications
Manjunath V. Joshi, R. Pendse, Vinayak Pandey et al. · 2010 · 34 citations
CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes
S. Movva, Steve Bezuk, Omar Bchir et al. · 2011 · 30 citations
Engineering, Electrical Engineering, Manufacturing Engineering +17
Bond-on-Lead: A Novel Flip-Chip Interconnection Technology for Fine Effective Pitch and High I/O Density
R. Pendse, K.M. Kim, K.O. Kim et al. · 2006 · 24 citations
Engineering, Electrical Engineering, Materials Science +17
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