Concepedia

S. Movva

SM

2

Publications

56

Citations

2

H-Index

2004

Active since

Affiliations

Kyocera (United States)(Current)

S. Movva is an author at Kyocera (United States) specializing in electrical engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringHeat TransferNanotechnologyApplied PhysicsNanoelectronicsFailure Analysis

Publications per year

2004–2011

2

Publications

2

CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

S. Movva, Steve Bezuk, Omar Bchir et al. · 2011 · 30 citations

Engineering, Flip Chip Package, Integrated Circuits +20

High reliability second level interconnects using polymer core BGAs

S. Movva, Gerardo Aguirre · 2004 · 26 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17

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