Steve Bezuk

CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

S. Movva, Steve Bezuk, Omar Bchir et al. · 2011 · 30 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Evaluation of Ag wire reliability on fine pitch wire bonding

Jiaqing Xi, Norbe Mendoza, Thomas C.‐K. Yang et al. · 2015 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +14

Challenges and opportunities of chip package interaction with fine pitch Cu pillar for 28nm

Andy Bao, Lily Zhao, Yangyang Sun et al. · 2014 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

A study of wafer level package board level reliability

Steven X. Xu, Beth Keser, Christine Hau-Riege et al. · 2013 · 14 citations

Engineering, Materials Engineering, Materials Science +16

0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

Beth Keser, Rey Alvarado, M. Philip Schwarz et al. · 2015 · 12 citations

Engineering, Materials Engineering, Manufacturing Processes +12