Concepedia

Rey Alvarado

RA

Statistics

Publications

2

Citations

22

H-Index

2

Active since

2014

Affiliations

Qualcomm (United Kingdom)(Current)

Qualcomm (United States)

Rey Alvarado is an author at Qualcomm (United Kingdom) specializing in materials engineering, wafer-level packaging, and failure criteria.

Publications per year

2014–2015

2

Publications

2

0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size

Beth Keser, Rey Alvarado, M. Philip Schwarz et al. · 2015 · 12 citations

Engineering, Materials Engineering, Manufacturing Processes +12

The impact of different under bump metallurgies and redistribution layers on the electromigration of solder balls for wafer-level packaging

Christine Hau-Riege, Beth Keser, Rey Alvarado et al. · 2014 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +16

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