Norbe Mendoza is an author at Qualcomm (United States) specializing in electronic packaging, mechanical engineering, and materials engineering.
Top concepts
EngineeringMicrostructureMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical Engineering
Publications per year
2015–2015
1
1
Evaluation of Ag wire reliability on fine pitch wire bonding
Jiaqing Xi, Norbe Mendoza, Thomas C.‐K. Yang et al. · 2015 · 23 citations
Materials Science, Materials Engineering, Electrical Engineering +14
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