Statistics
Publications
3
Citations
67
H-Index
3
Active since
2014
Affiliations
Qualcomm (United States)(Current)
Lily Zhao is an author at Qualcomm (United States) specializing in mechanical behavior of materials, integrated circuit design, and flip-chip bonding.
Publications per year
2014–2019
3
3
Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages
Wei Wang, Dingyou Zhang, Yangyang Sun et al. · 2018 · 11 citations
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