Concepedia

Dingyou Zhang

DZ

1

Publications

11

Citations

1

H-Index

2018

Active since

Affiliations

Qualcomm (United States)(Current)

Dingyou Zhang is an author at Qualcomm (United States) specializing in solid mechanics, electrical insulation, and plasticity.

Top concepts

PlasticityEngineeringPolymer ScienceSolid MechanicsMaterial ScienceMicroelectronicsElectronic PackagingElectrical InsulationElectrical EngineeringMechanical Engineering

Publications per year

2018–2018

1

Publications

1

Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages

Wei Wang, Dingyou Zhang, Yangyang Sun et al. · 2018 · 11 citations

Engineering, Mechanical Engineering, Radial Passivation Stress +18

Rows per page

1–1 of 1