Kim Yong Goh

Drop impact life prediction model for lead-free BGA packages and modules

Jing-en Luan, Tong Yan Tee, Kim Yong Goh et al. · 2005 · 41 citations

Engineering, Computer Engineering, Materials Engineering +14

Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

Hun Shen Ng, Tong Yan Tee, Kim Yong Goh et al. · 2005 · 40 citations

Engineering, Materials Engineering, Materials Science +13

Drop Impact Life Prediction Model for Wafer Level Chip Scale Packages

Kim Yong Goh, Jing-en Luan, Tong Yan Tee · 2006 · 22 citations

Engineering, Computer Engineering, Electrical Engineering +17

Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages

Yassine Bentata, S. Forster, Kim Yong Goh et al. · 2008 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17