Package-level Reliability

Package-Level Reliability is a semiconductor reliability subdiscipline that evaluates the structural integrity and performance stability of integrated circuit packages under environmental, mechanical, and thermal stresses throughout their operational lifespan.

810

Publications

24.9K

Citations

2.8K

Authors

465

Institutions

Publications per year

2017–2026

Parents

Semiconductor Reliability

Publications

810

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Commonly observed degradation in field-aged photovoltaic modules

Michael A. Quintana, D.L. King, T. J. McMahon et al. · 2003 · 288 citations

Engineering, Materials Engineering, Materials Science +17

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 275 citations

Engineering, Electrical Engineering, Materials Engineering +17

Silicon piezoresistive stress sensors and their application in electronic packaging

Jeffrey C. Suhling, R.C. Jaeger · IEEE Sensors Journal · 2001 · 274 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

Engineering, Materials Engineering, Materials Science +17

1–5 of 810

Authors

2.8K

JH
John H. Lau
Industrial Technology Research Institute, Taiwan
23 publications · 860 citations
17
h-index
YL
Yi‐Shao Lai
Advanced Semiconductor Engineering (Taiwan), Taiwan
19 publications · 625 citations
14
h-index
PL
Pradeep Lall
Auburn University, United States
15 publications · 487 citations
12
h-index
CY
Chang-Lin Yeh
Advanced Semiconductor Engineering (Taiwan), Taiwan
12 publications · 501 citations
12
h-index
LN
Luu Nguyen
Texas Instruments (United States), United States
12 publications · 276 citations
11
h-index

1–5 of 2.8K

Institutions

465

1–8 of 465

Venues

Microelectronics Reliability
114 publications · 4K citations
37
h-index
IEEE Transactions on Components Hybrids and Manufacturing Technology
28 publications · 856 citations
19
h-index
Journal of Electronic Packaging
22 publications · 922 citations
18
h-index
IEEE Transactions on Components and Packaging Technologies
22 publications · 753 citations
17
h-index
IEEE Transactions on Components Packaging and Manufacturing Technology
25 publications · 711 citations
16
h-index

1–5