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Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Electrical EngineeringReliability EngineeringEngineeringAdvanced Packaging (Semiconductors)Hardware ReliabilitySolid MechanicsFailure MechanismsElectronic PackagingDevice ReliabilityMicroelectronicsCurrent StressingMechanics Of MaterialsPhysic Of FailureAdvanced Electronic Packages