Chao-Pin Yeh

Drop/impact simulation and test validation of telecommunication products

Jing Wu, Gyun Song, Chao-Pin Yeh et al. · 2002 · 104 citations

Engineering, Mechanical Engineering, Computational Structural Analysis +16

Correlation of analytical and experimental approaches to determine thermally induced PWB warpage

Chao-Pin Yeh, Charles Ume, Robert E. Fulton et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 49 citations

Engineering, Computational Engineering, Electrical Engineering +16

Electro-thermo-mechanical responses of conductive adhesive materials

Kai Hu, Chao-Pin Yeh, K. Wyatt · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 34 citations

Natural Sciences, Materials Science, Physics +16

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Yonggang Huang, K.X. Hu, Chao-Pin Yeh et al. · Journal of Electronic Packaging · 1996 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

Kai Hu, Chao-Pin Yeh, Xin Wu et al. · Journal of Electronic Packaging · 1996 · 25 citations

Engineering, Materials Engineering, Materials Science +16