Publication | Closed Access
Correlation of analytical and experimental approaches to determine thermally induced PWB warpage
49
Citations
7
References
1993
Year
EngineeringMechanical EngineeringExperimental ApproachesInduced Pwb WarpageThermal AnalysisThermodynamicsThermal ModelingElectronic PackagingThermomechanical AnalysisMaterials EngineeringElectrical EngineeringSolid MechanicsManufacturing EngineeringHeat TransferThermomechanical ProcessingPrinted Wiring BoardHigh Temperature MaterialsApplied PhysicsThermomechanical Design EffectsDesign ProcessStructural MechanicsThermal EngineeringMechanics Of Materials
Thermomechanical design effects in the printed wiring board (PWB) design process are considered, In particular, a research project for developing advanced finite-element method (FEM)-oriented capabilities to simulate thermally induced PWB warpage is reported. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow Moire method.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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