S.K.W. Seah - Concepedia

Author

S.K.W. Seah

Also Known As

S K Seah, S SEAH, S. K. Seah, S. K. W. Seah, S.K. W. Seah, S.K.W Seah, S.K.W. Seah, S.k.w. Seah, Samuel K. W. Seah, Steve K Seah

Publications

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics National University of Singapore Singapore National Eye Center Singapore Eye Research Institute Philips (Netherlands)

About

S.K.W. Seah is an author at Institute of Microelectronics specializing in mechanical engineering, engineering, and mechanics of materials.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	21	804
2	Medicine	2	2	77
3	Civil Engineering	2	2	51
4	Public Health	1	1	108
5	Computer Engineering	1	1	102

S.K.W. Seah

Publications

2.8K

Citations

H-Index

Page 1

	Year	Citations
Prevalence and risk factors for refractive errors in adult Chinese in Singapore. Tien Yin Wong, Paul J. Foster, J Hee, PubMed	2000	730
Variations in ocular biometry in an adult Chinese population in Singapore: the Tanjong Pagar Survey. Tien Yin Wong, Paul J. Foster, Tze Pin Ng, PubMed	2001	278
Optic disk ovality as an index of tilt and its relationship to myopia and perimetry Eugene Tay, S.K.W. Seah, Siew‐Pang Chan, American Journal of Ophthalmology OphthalmologyGeometrical OpticEye TrackingVision ResearchOptometry	2005	277
The relationship between ocular dimensions and refraction with adult stature: the Tanjong Pagar Survey. Tien Yin Wong, Paul J. Foster, G J Johnson, PubMed	2001	172
Screening for Narrow Angles in the Singapore Population: Evaluation of New Noncontact Screening Methods Raghavan Lavanya, Paul J. Foster, Lisandro M. Sakata, Ophthalmology Population ChildrenSingapore PopulationDiagnosisNarrow AnglesPublic Health	2008	108
Drop impact survey of portable electronic products Chwee Teck Lim, C.W. Ang, Long Bin Tan, EngineeringImpact (Mechanics)Drop ImpactImpact LoadingDevice Reliability	2004	102
Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang,	2008	93
Drop Impact: Fundamentals and Impact Characterisation of Solder Joints E.H. Wong, R. Rajoo, Yiu‐Wing Mai, Materials ScienceDamage MechanismEngineeringImpact (Mechanics)Advanced Packaging (Semiconductors)	2005	84
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah, Journal of Electronic Materials Materials ScienceEngineeringMechanical EngineeringStressstrain AnalysisStress–strain Characteristics	2008	79
Advances in the drop-impact reliability of solder joints for mobile applications E.H. Wong, S.K.W. Seah, W.D. van Driel, Microelectronics Reliability EngineeringDurability PerformanceHardware ReliabilityMechanical EngineeringEngineering Failure Analysis	2009	64

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