L.C. Tan

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials · 2008 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +16

Stress–strain characteristics of tin-based solder alloys at medium strain rate

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Materials Letters · 2008 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +16

Correlation studies for component level ball impact shear test and board level drop test

E.H. Wong, R. Rajoo, S.K.W. Seah et al. · Microelectronics Reliability · 2008 · 40 citations

Engineering, Materials Engineering, Materials Science +13

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

E.H. Wong, S.K.W. Seah, Cheryl Selvanayagam et al. · Journal of Electronic Materials · 2009 · 24 citations

Engineering, Materials Engineering, Materials Science +13

A study of crack propagation in Pb-free solder joints under drop impact

J.F.J.M. Caers, E.H. Wong, S.K.W. Seah et al. · 2008 · 24 citations

Engineering, Materials Engineering, Materials Science +17