Concepedia

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

E.H. Wong, S.K.W. Seah, Cheryl Selvanayagam, R. Rajoo, W.D. van Driel, J.F.J.M. Caers, Xiujuan Zhao, N. Owens, M. Leoni, L.C. Tan,

Journal of Electronic Materials · 2009 · 24 citations · 3 references

DOI

Concepts

References

3

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials · 2008 · 79 citations

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Analytical Solutions for Interconnect Stress in Board Level Drop Impact

E.H. Wong, Yiu‐Wing Mai, S.K.W. Seah et al. · IEEE Transactions on Advanced Packaging · 2007 · 28 citations

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Tri-Layer Structures Subjected to Combined Temperature and Mechanical Loadings

E.H. Wong, C.K. Wong · IEEE Transactions on Components and Packaging Technologies · 2008 · 27 citations

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