J.F.J.M. Caers

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials · 2008 · 79 citations

Materials Science, Engineering, Mechanical Engineering +5

Advances in the drop-impact reliability of solder joints for mobile applications

E.H. Wong, S.K.W. Seah, W.D. van Driel et al. · Microelectronics Reliability · 2009 · 64 citations

Engineering, Durability Performance, Hardware Reliability +9

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L.J. Ernst, C. van ‘t Hof, Daoguo Yang et al. · Journal of Electronic Packaging · 2002 · 43 citations

Engineering, Mechanical Engineering, Residual Stress +20

Stress–strain characteristics of tin-based solder alloys at medium strain rate

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Materials Letters · 2008 · 40 citations

Materials Science, Medium Strain Rate, Engineering +5

Correlation studies for component level ball impact shear test and board level drop test

E.H. Wong, R. Rajoo, S.K.W. Seah et al. · Microelectronics Reliability · 2008 · 40 citations

Engineering, Impact (Mechanics), Mechanics +6