Advances in the drop-impact reliability of solder joints for mobile applications - Concepedia

Concepedia

Publication | Closed Access

Advances in the drop-impact reliability of solder joints for mobile applications

64

Citations

17

References

2009

Year

E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y. S. Lai

Microelectronics Reliability

EngineeringDurability PerformanceHardware ReliabilityMechanical EngineeringEngineering Failure AnalysisMobile ApplicationsSolder JointsElectronic PackagingDevice ReliabilityMechanics Of MaterialsPhysic Of FailureDrop-impact Reliability

References

	Year	Citations

Page 1

Page 1