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Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

ReliabilityReliability EngineeringEngineeringBoard-level ReliabilityChip-scale PackageHardware ReliabilityExperimental StudiesChip On BoardSoftware TestingComputer EngineeringChip-scale PackagesChip AttachmentElectronic PackagingDevice ReliabilityMicroelectronics