C.-P Hung

An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Chang-Chi Lee, C.-P Hung, Calvin Cheung et al. · 2016 · 131 citations

System On Chip, Electrical Engineering, Silicon Interposer +14

A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Wei‐Hong Lai, Penny Yang, Ian Hu et al. · 2020 · 41 citations

Chip First, Engineering, Computer Architecture +18

Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package

Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 35 citations

Fm Package, Electrical Engineering, Fo Package +15

FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages

Meng-Kai Shih, Karen Chen, Teck Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 34 citations

Engineering, Mechanical Engineering, Glass Interposer Substrates +21

Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Meng-Kai Shih, Wei‐Hong Lai, Tse-Wei Liao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 27 citations

Engineering, Substrate Chip-first, Integrated Circuits +21