Concepedia

Teck Lee

TL

2

Publications

50

Citations

2

H-Index

2017

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Teck Lee is an author at Advanced Semiconductor Engineering (Taiwan) specializing in solid mechanics, mechanical engineering, and 3d printing.

Top concepts

3D PrintingEngineeringSolid MechanicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingFlexible ElectronicsMechanical EngineeringMechanics Of Materials

Publications per year

2017–2021

2

Publications

2

FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages

Meng-Kai Shih, Karen Chen, Teck Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 34 citations

Engineering, Mechanical Engineering, Glass Interposer Substrates +21

Warpage Characterization of Glass Interposer Package Development

Meng-Kai Shih, Charles Hsu, Yung-Shun Chang et al. · 2017 · 16 citations

Engineering, Mechanical Engineering, Glass Wafer +16

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