Yung-Shun Chang

Statistics

Publications

Citations

129

H-Index

Active since

2016

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Yung-Shun Chang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in integrated circuit design, engineering, and chip packaging.

Publications per year

2016–2022

Publications

Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application

Lihong Cao Teck Lee, Yung-Shun Chang, SimonYL Huang et al. · 2021 · 32 citations

Engineering, Computer Engineering, High-performance Computing +15

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Lihong Cao, Teck Chong Lee, Rick Chen et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 26 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +15

Glass Based 3D-IPD Integrated RF ASIC in WLCSP

Teck Chong Lee, Yung-Shun Chang, Che‐Ming Hsu et al. · 2017 · 24 citations

Engineering, Electrical Engineering, Materials Science +17

Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration

Jen-Hsien Wong, Nan-Yi Wu, Wei‐Hong Lai et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 18 citations

Engineering, Computer Engineering, High-performance Computing +15

Warpage Characterization of Glass Interposer Package Development

Meng-Kai Shih, Charles Hsu, Yung-Shun Chang et al. · 2017 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17

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