Yung-Shun Chang

Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application

Lihong Cao Teck Lee, Yung-Shun Chang, SimonYL Huang et al. · 2021 · 30 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Lihong Cao, Teck Chong Lee, Rick Chen et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 25 citations

Engineering, Advanced Packaging Technologies, Advanced Packaging (Semiconductors) +17

Glass Based 3D-IPD Integrated RF ASIC in WLCSP

Teck Chong Lee, Yung-Shun Chang, Che‐Ming Hsu et al. · 2017 · 24 citations

Engineering, Glass Wafer, Electromagnetic Compatibility +18

Warpage Characterization of Glass Interposer Package Development

Meng-Kai Shih, Charles Hsu, Yung-Shun Chang et al. · 2017 · 16 citations

Engineering, Mechanical Engineering, Glass Wafer +16

Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration

Jen-Hsien Wong, Nan-Yi Wu, Wei‐Hong Lai et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations