2
Publications
52
Citations
2
H-Index
2010
Active since
Affiliations
Penny Yang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in computer engineering, electronic packaging, and electrical engineering.
Top concepts
EngineeringMicroelectronicsComputer EngineeringElectronic PackagingElectrical EngineeringHeat TransferMicrofabricationIntegrated CircuitsComputer ArchitectureThree-dimensional Heterogeneous Integration
Publications per year
2010–2020
2
2
A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
Wei‐Hong Lai, Penny Yang, Ian Hu et al. · 2020 · 41 citations
Coreless substrate for high performance flip chip packaging
James Wang, Lia Liao, Penny Yang et al. · 2010 · 11 citations
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