4
Publications
102
Citations
4
H-Index
2011
Active since
Affiliations
Ian Hu is an author at Advanced Semiconductor Engineering (Taiwan) specializing in electronic packaging, engineering, and microelectronics.
Top concepts
EngineeringMicroelectronicsElectronic PackagingHeat TransferMicrofabricationComputer EngineeringComputer ArchitectureElectrical EngineeringMechanical Engineering3D Printing
Publications per year
2011–2020
4
4
A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
Wei‐Hong Lai, Penny Yang, Ian Hu et al. · 2020 · 41 citations
Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
Ying-Chih Lee, Wei‐Hong Lai, Ian Hu et al. · 2017 · 35 citations
Engineering, Mechanical Engineering, Computer Architecture +20
Warpage Characterization of Glass Interposer Package Development
Meng-Kai Shih, Charles Hsu, Yung-Shun Chang et al. · 2017 · 16 citations
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