Ying-Chih Lee

Publications

Citations

H-Index

2008

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Ying-Chih Lee is an author at Advanced Semiconductor Engineering (Taiwan) specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringReliabilityComputer EngineeringFinite Element MethodElectrical EngineeringPlasticityHeat TransferModal Analysis

Publications per year

2008–2017

Publications

Fan-Out Chip on Substrate Device Interconnection Reliability Analysis

Ying-Chih Lee, Wei‐Hong Lai, Ian Hu et al. · 2017 · 35 citations

Engineering, Mechanical Engineering, Computer Architecture +20

Finite element model verification for packaged printed circuit board by experimental modal analysis

Ying-Chih Lee, Bor‐Tsuen Wang, Yi‐Shao Lai et al. · Microelectronics Reliability · 2008 · 26 citations

Modal Analysis, Finite Element Method, Physical Design (Electronics) +13

Solder joint reliability analysis for large size WLCSP

Meng-Kai Shih, Hsin-Chih Shih, Ying-Chih Lee et al. · 2017 · 11 citations

Engineering, Mechanical Engineering, Solder Interconnection +19

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