Statistics
Publications
1
Citations
11
H-Index
1
Active since
2010
Affiliations
Lia Liao is an author at Advanced Semiconductor Engineering (Taiwan) specializing in electrical engineering, packaging reliability, and package parasitics.
Publications per year
2010–2010
1
1
Coreless substrate for high performance flip chip packaging
James Wang, Lia Liao, Penny Yang et al. · 2010 · 11 citations
Engineering, Computer Engineering, Electrical Engineering +16
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