Tsan-Hsien Chen

Publications

Citations

H-Index

2006

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Tsan-Hsien Chen is an author at Advanced Semiconductor Engineering (Taiwan) specializing in electronic packaging, engineering, and computer engineering.

Top concepts

EngineeringElectronic PackagingReliabilityHeat TransferMicroelectronicsSoftware TestingThermal EngineeringComputer EngineeringElectrical EngineeringMechanical Engineering

Publications per year

2006–2019

Publications

Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package

Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 35 citations

Fm Package, Electrical Engineering, Fo Package +15

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang et al. · 2006 · 22 citations

Reliability, Chip-scale Package, Engineering +11

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