Chih-Yi Huang

Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package

Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 35 citations

Fm Package, Electrical Engineering, Fo Package +15

Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity

Keng Tuan Chang, Chih-Yi Huang, Hung‐Chun Kuo et al. · 2019 · 32 citations

Engineering, Vlsi Design, Hbm Die +18

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Lihong Cao, Teck Chong Lee, Rick Chen et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 25 citations

Engineering, Advanced Packaging Technologies, Advanced Packaging (Semiconductors) +17

Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications

Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan et al. · 2017 · 21 citations

Millimeter Wave Technology, Engineering, Antenna +10

Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration

Lihong Cao, Chen-Chao Wang, Chih-Yi Huang et al. · 2023 · 10 citations