Hung‐Chun Kuo

Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity

Keng Tuan Chang, Chih-Yi Huang, Hung‐Chun Kuo et al. · 2019 · 32 citations

Engineering, Vlsi Design, Hbm Die +18

Advanced Fanout Packaging Technology for Hybrid Substrate Integration

Lihong Cao, Teck Chong Lee, Rick Chen et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 25 citations

Engineering, Advanced Packaging Technologies, Advanced Packaging (Semiconductors) +17

Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

Chiu-Wen Lee, Hung‐Chun Kuo, Min-Hua Chung et al. · 2018 · 22 citations

D Package, Engineering, Optoelectronic Devices +21

Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process

Chiu-Wen Lee, Hung‐Chun Kuo, Chen-Chao Wang et al. · 2018 · 20 citations

D Package, Organic Film, Engineering +23

A <i>D</i>-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate

Hung‐Chun Kuo, Chih‐Wen Kuo, Chen-Chao Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 17 citations