Concepedia

Chiu-Wen Lee

CL

4

Publications

80

Citations

4

H-Index

2005

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Chiu-Wen Lee is an author at Advanced Semiconductor Engineering (Taiwan) specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMaterial ScienceAdvanced PackagingElectrical EngineeringThin Films3D PrintingMicrofabrication

Publications per year

2005–2018

4

Publications

4

Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-Chip Solder Interconnects

Yi‐Shao Lai, Chiu-Wen Lee, Chin‐Li Kao · Journal of Electronic Packaging · 2006 · 24 citations

Advanced Packaging, Materials Science, Electrical Engineering +14

Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

Chiu-Wen Lee, Hung‐Chun Kuo, Min-Hua Chung et al. · 2018 · 22 citations

D Package, Engineering, Optoelectronic Devices +21

Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process

Chiu-Wen Lee, Hung‐Chun Kuo, Chen-Chao Wang et al. · 2018 · 20 citations

D Package, Organic Film, Engineering +23

Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages

Yi‐Shao Lai, S. Sathe, Chin‐Li Kao et al. · 2005 · 14 citations

Engineering, Experimental Electromigration Reliability, Flip-chip Packages +18

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