Tse-Wei Liao

Publications

Citations

H-Index

2020

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Tse-Wei Liao is an author at Advanced Semiconductor Engineering (Taiwan) specializing in microelectronics, electronic packaging, and electrical engineering.

Top concepts

EngineeringHeat TransferMicroelectronicsIntegrated CircuitsComputer EngineeringElectronic PackagingElectrical EngineeringThree-dimensional Heterogeneous IntegrationMicrofabricationAdvanced Packaging

Publications per year

2020–2022

Publications

A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

Wei‐Hong Lai, Penny Yang, Ian Hu et al. · 2020 · 41 citations

Chip First, Engineering, Computer Architecture +18

Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Meng-Kai Shih, Wei‐Hong Lai, Tse-Wei Liao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 27 citations

Engineering, Substrate Chip-first, Integrated Circuits +21

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