Yi-Wun Wang

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Yi-Wun Wang, Yan‐Cheng Lin, Chun-Te Tu et al. · Journal of Alloys and Compounds · 2008 · 189 citations

Materials Science, Materials Engineering, Chemical Engineering +9

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Yi-Wun Wang, Yan‐Cheng Lin, C. R. Kao · Microelectronics Reliability · 2008 · 103 citations

Materials Engineering, Materials Science, Engineering +9

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

C. C. Chang, Yan‐Cheng Lin, Yi-Wun Wang et al. · Journal of Alloys and Compounds · 2009 · 101 citations

Consumption Rate, Solder Volume, Cu Pad

Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Yi-Wun Wang, Chia-Wei Chang, C. R. Kao · Journal of Alloys and Compounds · 2008 · 91 citations

Materials Science, Materials Engineering, Electrical Engineering +4

Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding

Jiunn Chen, Yi‐Shao Lai, Yi-Wun Wang et al. · Microelectronics Reliability · 2010 · 55 citations

Materials Science, Cu Wire Bonding, Materials Engineering +7