C. C. Chang

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

C. C. Chang, Yan‐Cheng Lin, Yi-Wun Wang et al. · Journal of Alloys and Compounds · 2009 · 101 citations

Consumption Rate, Solder Volume, Cu Pad

Ge_0975Sn_0025 320  ×  256 imager chip for 16–19  μm infrared vision

C. C. Chang, Hui Li, Chien-Te Ku et al. · Applied Optics · 2016 · 33 citations

Multi-layer thin-film substrates for multi-chip packaging

Chun‐Chieh Chao, K.D. Scholz, J. Leibovitz et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 24 citations

Engineering, Multiple Chip Module, Computer Architecture +19

Room-temperature 2-<i>μ</i>m GeSn P-I-N homojunction light-emitting diode for inplane coupling to group-IV waveguides

C. C. Chang, Tai‐Wei Chang, Hui Li et al. · Applied Physics Letters · 2017 · 20 citations

Engineering, Optoelectronic Devices, Group-iv Waveguides +17

Multilayer thin-film substrate for multichip packaging

Chun‐Chieh Chao, K.D. Scholz, J. Leibovitz et al. · 2003 · 17 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17