Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Materials Science, Interfacial Reactions, Engineering +4

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

Interfacial reaction issues for lead-free electronic solders

Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations

Materials Science, Electrical Engineering, Engineering +6

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 247 citations

Materials Science, Electrical Engineering, Reliability Engineering +15

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Materials Science, Materials Engineering, Sn-pb Eutectic Solders +10