Concepedia

M. Li

ML

9

Publications

640

Citations

9

H-Index

2001

Active since

Affiliations

Institute of Materials Research and Engineering(Current)

University of California, Los Angeles

M. Li is an author at Institute of Materials Research and Engineering specializing in materials science, microstructure, and engineering.

Top concepts

EngineeringMicrostructureMaterial ScienceMaterials EngineeringElectronic PackagingApplied PhysicsMicroelectronicsMicrofabricationCorrosionThin Films

Publications per year

2001–2005

9

Publications

9

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 353 citations

Materials Engineering, Materials Science, Materials Challenges +15

Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films

M. Li, F. Zhang, W. T. Chen et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 92 citations

Materials Science, Materials Engineering, Aluminium Nitride +8

Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles

F. Zhang, M. Li, Chan Choy Chum et al. · Journal of Electronic Materials · 2003 · 39 citations

Materials Science, Materials Engineering, Chip-scale Package +12

Fracture toughness of Cu-Sn intermetallic thin films

Bavani Balakrisnan, Chan Choy Chum, M. Li et al. · Journal of Electronic Materials · 2003 · 37 citations · Full text

Materials Science, Materials Engineering, Engineering +5

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

F. Zhang, M. Li, Chan Choy Chum et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 33 citations

Materials Science, Chip-scale Package, Engineering +13

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