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Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles

Materials ScienceMaterials EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Multiple Reflow CyclesMicrofabricationChip On BoardChip AttachmentFlip-chip PackagesSubstrate MetallizationElectronic PackagingMicroelectronicsMicrostructureMetal Processing