Concepedia

F. Zhang

FZ

Statistics

Publications

4

Citations

179

H-Index

4

Active since

2002

Affiliations

Institute of Materials Research and Engineering(Current)

University of California, Los Angeles

F. Zhang is an author at Institute of Materials Research and Engineering specializing in electronic packaging, microstructure, and materials science.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingApplied PhysicsMicroelectronicsMicrofabricationMaterials EngineeringCorrosionThin Films

Publications per year

2002–2003

4

Publications

4

Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films

M. Li, F. Zhang, W. T. Chen et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 92 citations

Materials Science, Materials Engineering, Aluminium Nitride +8

Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles

F. Zhang, M. Li, Chan Choy Chum et al. · Journal of Electronic Materials · 2003 · 39 citations

Materials Science, Materials Engineering, Chip-scale Package +12

Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

F. Zhang, M. Li, Chan Choy Chum et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 33 citations

Materials Science, Chip-scale Package, Engineering +13

Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging

F. Zhang, M. Li, Chan Choy Chum et al. · Journal of materials research/Pratt's guide to venture capital sources · 2003 · 15 citations

Materials Engineering, Materials Science, Chip-scale Package +15

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