Tia‐Marje Korhonen

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 198 citations

Natural Sciences, Materials Engineering, Materials Science +11

Thermodynamics of the Sn-In-Ag solder system

Tia‐Marje Korhonen, J.K. Kivilahti · Journal of Electronic Materials · 1998 · 83 citations

Natural Sciences, Materials Engineering, Materials Science +12

Reactions of lead-free solders with CuNi metallizations

Tia‐Marje Korhonen, Peng Su, Sukwon Hong et al. · Journal of Electronic Materials · 2000 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +11

Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

Tia‐Marje Korhonen, L.P. Lehman, M. A. Korhonen et al. · Journal of Electronic Materials · 2007 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +14

Multi-level single mode 2D polymer waveguide optical interconnects using nano-imprint lithography

Umar Khan, John Justice, Jarno Petäjä et al. · Optics Express · 2015 · 42 citations · Full text

Engineering, Electrical Engineering, Materials Science +17