Concepedia

Timothy Gosselin

TG

8

Publications

915

Citations

8

H-Index

2002

Active since

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

Samsung (South Korea)

Korea Advanced Institute of Science and Technology

Endicott College

Timothy Gosselin is an author at IBM (United States) specializing in materials engineering, microstructure, and materials science.

Top concepts

Publications per year

2002–2004

8

Publications

8

Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

, , +6

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

, , +6

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Sung K. Kang, Da‐Yuan Shih, NY. Donald et al. · JOM · 2003 · 163 citations

, , +6

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard et al. · JOM · 2004 · 156 citations

, , +10

Interfacial reaction studies on lead (Pb)-free solder alloys

S. K. Kang, Da‐Yuan Shih, Keith Fogel et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 81 citations

, , +15

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