Full Bottom Dielectric Isolation to Enable Stacked Nanosheet Transistor for Low Power and High Performance Applications

J. Zhang, Julien Frougier, Andrew Greene, +34

EngineeringSemiconductor DeviceAdvanced Packaging (Semiconductors)NanoelectronicsElectronic Engineering +15

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang, +21

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueCu Liner +13

Experimental study of nanoscale Co damascene BEOL interconnect structures

James J. Kelly, Jinai Chen, Huai Huang, +14

EngineeringNm Node DimensionsMaterial InnovationCo Line ResistanceInterconnect (Integrated Circuits) +14

Fifteen Nanometer Resolved Patterns in Selective Area Atomic Layer Deposition—Defectivity Reduction by Monolayer Design

Rudy J. Wojtecki, Magi Mettry, Noah F. Fine Nathel, +4

ACS Applied Materials & Interfaces

Materials ScienceEngineeringBeam LithographySurface FunctionalizationSelective Removal +11

Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects

A. Simon, T. Bolom, Chunping Niu, +13

EngineeringElectrode-electrolyte InterfaceInterconnect (Integrated Circuits)Chemical EngineeringNanoelectronics +14

BEOL process integration for the 7 nm technology node

T. Standaert, Genevieve Beique, H.-C. Chen, +28

EngineeringElectron-beam LithographyDevice IntegrationBeol Process IntegrationSelective Co Cap +15

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly, +28

Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering +11

Mechanisms of Electromigration Damage in Cu Interconnects

Chunhua Hu, L. Gignac, G. Lian, +11

Materials EngineeringMaterials ScienceElectrical EngineeringVarious Cmos NodesEm Activation Energy +11

Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

T. Nogami, R. Patlolla, James J. Kelly, +17

Materials ScienceMaterials EngineeringElectrical EngineeringCobalt/copper Composite InterconnectsEngineering +12

In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects

C.-C. Yang, B. Li, H. Shobha, +6

IEEE Electron Device Letters

EngineeringSitu Co/sicChemical DepositionInterconnect (Integrated Circuits)Chemical Engineering +17