Chunping Niu

A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar et al. · 2016 · 144 citations

Engineering, Electrical Engineering, Materials Science +15

Low-voltage circuit breaker arcs—simulation and measurements

Fei Yang, Yi Wu, Mingzhe Rong et al. · Journal of Physics D Applied Physics · 2013 · 134 citations

Engineering, Electrical Engineering, Physics +12

Cu interactions with α-Al2O3(0001): effects of surface hydroxyl groups versus dehydroxylation by Ar-ion sputtering

Chunping Niu, K Shepherd, D. Martini et al. · Surface Science · 2000 · 101 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Investigation on Arc Behavior During Arc Motion in Air DC Circuit Breaker

Ruiguang Ma, Mingzhe Rong, Fei Yang et al. · IEEE Transactions on Plasma Science · 2013 · 93 citations

Engineering, Electrical Engineering, Circuit Theory +13

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui et al. · 2016 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17