A. Simon

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

Engineering, Computer Engineering, Electrical Engineering +17

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Computer Engineering, Electrical Engineering +17

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Natural Sciences, Electrical Engineering, Materials Science +16

WZB117 (2-Fluoro-6-(m-hydroxybenzoyloxy) Phenyl m-Hydroxybenzoate) Inhibits GLUT1-mediated Sugar Transport by Binding Reversibly at the Exofacial Sugar Binding Site

Ogooluwa Ojelabi, Kenneth P. Lloyd, A. Simon et al. · Journal of Biological Chemistry · 2016 · 107 citations · Full text

Life Sciences, Biochemistry, Molecular Biology +7

A high performance liner for copper damascene interconnects

D. Edelstein, Cyprian Uzoh, C. Cabral et al. · 2001 · 92 citations

Engineering, Computer Engineering, Electrical Engineering +17