Concepedia
Statistics
Publications
31
Citations
1.1K
H-Index
17
Active since
1994
Affiliations
IBM (United States)(Current)
GlobalFoundries (United States)
IBM Research - Thomas J. Watson Research Center
Toshiba (United States)
STMicroelectronics (United States)
T. Nogami is an author at IBM (United States) specializing in materials science, materials engineering, and metals.
Publications per year
1994–2021
Microstructure and reliability of copper interconnects
Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 187 citations
Natural Sciences, Electrical Engineering, Materials Science +16
Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill
Meng‐Dong He, Xingxing Zhang, T. Nogami et al. · Journal of The Electrochemical Society · 2013 · 109 citations
Natural Sciences, Materials Engineering, Materials Science +13
Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects
C.-C. Yang, Sidney Cohen, T. M. Shaw et al. · IEEE Electron Device Letters · 2010 · 90 citations
Natural Sciences, Materials Engineering, Materials Science +15
Measuring hydraulic permeability in a streambed using the packer test
Hiroyuki Yamada, Futoshi Nakamura, Yasuharu WATANABE et al. · Hydrological Processes · 2005 · 69 citations
Engineering, Hydrology, Environmental Flows +16
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
E. Leobandung, H. Nayakama, D. Mocuta et al. · 2005 · 65 citations
Engineering, Computer Engineering, Electrical Engineering +17
1–5 of 31